Load-lock type Sputtering System CS-200 Series

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CS-200-Series

Load-lock type Sputtering System CS 200 is for research & development and small production application.

features

Substrate transfer capability up to Φ300mm (Deposition performance up to Φ200mm).
Automatic multi-layered deposition by recipe control.
Capable of automatic substrate transfer by simply loading the substrate on to manipulator in the Load-lock chamber.
Cassete chamber available five substrates stocker inside of load-lock chamber.
Co-sputtering and Multi-layer deposition using multi cathodes.
Bias-sputtering available with optional substrate Bias power supply.

applications

R&D
Small production purpose

Company Profile

Sells and provides customer support for vacuum equipments and components

contact us

ULVAC Singapore Pte.Ltd.
India Branch

301, Tara Tycoon 12-13-97, Tarnaka Secunderabad – 500 017, India

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